Which statement is true regarding bond strengths of self-etching adhesive systems to enamel?

When considering the bond strengths of self-etching adhesive systems to enamel, it is understood that these systems generally demonstrate improved bonding to prepared enamel compared to unprepared enamel. This improvement is attributed to the mechanical interlocking that occurs when the enamel surface is etched or prepared, creating a more favorable morphology for the adhesive to penetrate and bond effectively. When enamel is prepared, the conditioning process removes some of the outermost enamel layer and may create a surface profile that allows for greater mechanical retention of the adhesive.

Additionally, self-etching systems often have the ability to simultaneously etch and prime the enamel, which can further enhance the bond strength through better surface interaction. Therefore, a higher microtensile bond strength is expected with self-etching adhesives when they are applied to prepared enamel surfaces, confirming that the preparation enhances the bonding capability of these adhesives.